A copper/polyimide Metal-base packaging technology

A unique substrate MCPM (Mitsubishi Copper Polyimide Metal-base) technology has been developed by applying our basic copper/polyimide technology.¹ This new substrate technology MCPM is suited for a high-density, multi-layer, multi-chip, high-power module/package, such as used for a computer. The new MCPM was processed using a copper metal base (110 × 110 mm), full copper system (all layers) with 50-μm fine lines. As for pad metallizations for the IC assembly, we evaluated both Ni/Au for chip and wire ICs and solder for TAB ICs. The total number of assembled ICs is 25. To improve the thermal dispersion, copper thermal vias are simultaneously formed by electro-plating. This thermal via is located between the IC chip and copper metal base, and promotes heat dispersion. We employed one large thermal via (4.5 mm^?) and four small vias (1.0 mm^?) for each IC pad. The effect of thermal vias and/or base metal is simulated by a computer analysis and compared with an alumina base substrate. The results show that the thermal vias are effective at lowering the temperature difference between the IC and base substrate, and also lowering the temperature rise of the IC chip. We also evaluated the substrate’s reliability by adhesion test, pressure cooker test, etc.     

一种新的修正恒模算法

阐述了恒模算法(CMA)、修正恒模算法(MCMA)和判决引导(DD)算法的基本原理。针对CMA和MCMA收敛速度慢,固定步长条件下收敛速度和剩余误差之间存在矛盾的缺陷,在分析CMA误差特性的基础上,利用DD算法误差函数的模值和判决器输出构造新的误差函数,提出了一种新的变步长MCMA。新算法在加快收敛速度的同时保持小的剩余误差。仿真结果表明,新算法比CMA和MCMA收敛速度快,均衡输出剩余码间干扰(ISI)小而且能克服相位偏移,具有很好的实用性。     

一种改进MVI-CFAR检测器的性能分析

VI-CFAR检测器在均匀环境和非均匀环境下均具有较强的自适应性,但若前后两个参考滑窗均存在干扰目标时,VI-CFAR检测性能急剧下降。为克服该问题,本文采用有序统计平均CFAR和有序统计选小CFAR来替代VI-CFAR中最小选择CFAR。所提出的算法不但解决了干扰目标位置随机分布的问题,还解决了当其中一个滑窗的干扰目标数超过最大容限时检测性能下降的问题。在参考滑窗中干扰目标个数与扰噪比均不相同的情况下,分析了统计量VI的变化,有助于评估和设计VI-CFAR类检测器在多目标环境下抗干扰目标的最大容限。仿真结果表明,该改进算法提高了VI-CFAR在多目标环境下的鲁棒性,与其他改进算法相比,其排序处理时间降低一倍。     

Preparation of β-cyclodextrin/SBS modified asphalts for the improvement of anti-aging,rheological property,and storage stability

Styrene-butadiene-styrene (SBS) modified asphalt (SMA) has been widely used in road engineering for decade. However, the phase separation of SMA was obvious during the transport and SBS degraded after aging. To resolve these problems, β-cyclodextrin (β-CD) was used to modify SMA in this work. Conventional properties, storage stability, the effect of short-term aging on the morphology, and rheological property for SMA and β-CD/SMA were investigated. The softening point of modified asphalt reached to the maximum of 66.7°C when 1 wt% β-CD was added to SMA, where the penetration had shown the minimum of 80.8 dmm. In addition, the ductility of β-CD/SMA increased to the maximum of 797 mm when the content of β-CD was increased to 5 wt%. Furthermore, incorporation of β-CD improved the storage stability of SMA. Importantly, the aggregation of SBS was observed in β-CD/SMA, but modifiers distributed uniformly after a short-term aging. The rutting resistance and antiaging performances of SMA were also improved by the addition of β-CD. Considering the comprehensive properties of modified asphalt, the optimum content of β-CD was found to be 2 wt%.     

大气电场倒转与突发钠层及突发E层的相关性

突发钠层(Sporadic Sodium Layer, Na_S)是中高层大气金属层最为显著的一种现象,其发生机制目前尚无定论。突发E层(Sporadic E layer, E_S)是等离子体密度异常增大的薄层,被认为与Na_S密切相关。为进一步研究Na_S及E_S事件之间相关性及影响因素,利用中国科学院“子午工程”2010～2018年合肥科大站宽带钠荧光共振激光雷达观测结果,并结合武汉左岭镇站数字测高仪及九峰站大气电场仪数据,分析大气电场倒转(即北向电场)对Na_S以及E_S事件的影响。在统计的91例Na_S事件中,发生于大气电场倒转时的比例为20/91; 同时,在发生Na_S事件的事例中,E_S消失或中断的比例较大(14/20),表明E_S可能以提供钠源的形式转化为Na_S。此外,在分析武汉左岭镇站数字测高仪数据的同时进行概率统计,结果表明:当大气电场倒转时,E_S临界频率减小甚至消失的概率较大(187/242),少数情况下可能造成临界频率增大甚至激发E_S生成(55/242); E_S虚高消失比例为179/242,E_S不变比例为27/242,E_S上升比例为23/242。综上所述,大气北向电场在一定程度上对E_S事件的发生有抑制作用,并对E_S事件的发生高度有明显影响。最后,对一种与电场倒转相关的突发钠层机制也进行了讨论。     

高温高湿盐环境下SBS改性沥青胶浆的高温性能

基于自行设计的室内盐蚀干湿循环试验,采用动态剪切流变仪,对SBS改性沥青胶浆进行温度扫描试验和多重应力重复蠕变恢复(MSCR)试验. 以3.2 kPa应力下的不可恢复蠕变柔量J_nr,3.2为胶浆高温流变性能评价指标,分析试验环境和干湿循环耦合作用对胶浆流变性能的影响. 采用灰色关联理论,探究J_nr,3.2与常规流变参数、干湿循环次数及试验环境之间的关联性. 结果表明,随着盐蚀干湿循环次数的增加,胶浆的复数切变模量、车辙因子及J_nr,3.2均呈增大趋势,相位角和蠕变恢复率呈减小趋势. 在同种试验条件下,硫酸盐环境对胶浆高温性能的影响最大. J_nr,3.2与改进型车辙因子、试验环境的灰色关联度最大,关联度系数均大于0.93. 建议采用日常清扫、定期洒水冲洗的方式来减小路面盐分的积累,提高高温高湿环境中沥青路面的抵抗变形的能力.     

还原气氛下耐高温材料的渗碳破坏

耐热钢在还原性气氛下工作时,常发生粉化剥落现象.经分析与实体零件的宏观与微观组织观察,此现象是因为还原介质渗入,引起合金体积膨胀而产生引力,造成应力裂纹.加入与介质结合力不强的元素铝,有阻碍介质渗入和扩散的作用.     

抗氧剂、光稳定剂在聚碳酸酯和改性材料中的应用技术

简单介绍了抗氧剂和光稳定剂作用、功能和类别。列举了不同抗氧剂、光稳定剂条件下聚碳酸酯和ABS改性合金材料热老化试验的数据:亚磷酸酯抗氧剂和受阻酚抗氧剂的配合体系,可以有效保护聚碳酸酯的相对黏度和色泽,提高PC/ABS合金拉伸强度和缺口冲击强度;使用紫外线吸收剂可以有效地延缓聚碳酸酯变黄并适当保持强度;经试验或实际应用确定的抗氧剂、光稳定剂体系,抗氧剂、光稳定剂只是在确定的条件下才能有确定的作用,确定的条件有微小变化,抗氧剂、光稳定剂的作用与功能可能受到较大影响。     

改性羧甲基壳聚糖的制备及其去除冶炼废水中的氟

采用自制铁基生物絮凝剂（BPFS）对羧甲基壳聚糖(CMC)进行改性,并研究其对废水中氟的去除。考察了羧甲基壳聚糖CMC/Fe质量比、BPFS-CMC投加量、pH、反应时间对氟离子去除效果的影响。结果表明,水中残余氟离子浓度随CMC/Fe质量比升高而升高;随改性羧甲基壳聚糖投加量的增加而降低,而且与羧甲基壳聚糖单独处理含氟废水相比,氟离子去除效果有明显提高,当BPFS-CMC投加量为3%（体积分数）时,氟离子去除率由33.05%提高到62.70%;酸性条件有利于氟离子的去除;随反应时间的增加,氟离子浓度缓慢下降。当羧甲基壳聚糖CMC/Fe质量比为0.05,投加量3%,pH=5,反应时间10 min时,水中残余氟离子浓度为7.78 mg/L,低于国家《铅、锌工业污染物排放标准》(GB 25466—2010)规定的限值。     

某滨海电厂钢结构腐蚀防护

滨海某电厂4台机组锅炉炉架及其附属钢结构在海洋大气环境中腐蚀严重，其主要腐蚀原因是海洋大气中富含盐分，干湿交替导致金属表面盐浓度较高，水膜中富含氧分子，且溶有其它酸性气体，腐蚀性极强，因而钢结构腐蚀较快。为此提出有机涂层配套体系和热喷锌或喷铝两种解决方案，以确保电厂设施正常安全运行。